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Help CenterBIWIN MLC Flash CF Card F6110 for MID/Digital Camera/Notebook
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Specifications
*Compliant with compact flash specification 6.0*Compliant with ATA/ATPI-8
*Support global wear-leveling and SMART
| Product Model: | F6108 |
| Interface: | CF-50pin |
| Connector: | Cf50 ECEPTACLE 50P FEMALE |
| Flash Type: | MLC |
| Capacity: | 32GB / 64GB / 128GB |
| Max Transfer Performance (Varies by density): |
Read: 150MB/s |
| Write: 50MB/s | |
| ECC: | BCH ECC 72 bits/1KB |
| Operating Voltage: | 3.3V / 5V |
| Max Power Consumption (Varies by density): | 0.1W (Idle) |
| 1.5W (Active) | |
| Operating Temperature: | 0~70°C / -20~70°C |
| Storage Temperature: | -20~85 |
| Humidity: | 5% ~ 95% |
| MTBF: | 2,000,000 hours |
| Shock: | 50(G), 11(ms), half-sine wave |
| Vibration: | 3.1G (2-500Hz) |
| Dimensions(mm): | 42.8*36.2*3.3mm |
| Weight: | ≤12g |
About BIWIN
Corporate Overview:
Founded as an electronic product manufacturer in Shenzhen, China 1995, BIWIN specializes in producing flash storage products, including solid state drives, Compact Flash cards and USB flash drives. With 18 years' industry expertise and a strong team with over 150 skilled engineers, BIWIN develops its leading edge flash storage products completely in-house, including Solution Designing, Wafer packaging, IC Testing, SMT and Assembling, Product Testing. Manufacturing is conducted according to strict quality standards to ensure consistently high quality products.
BIWIN Vision Statement:
BIWIN strives to become a leader in consumer electronic industry in the world.
BIWIN's Win-Win Philosophy:
BIWIN determines to be customer's best partner by understanding customers’needs and meeting their requirements. While customers enhance their core competitive ability, BIWIN perfects its services and becomes stronger. This is our Win-Win philosophy.
Full range of Product Line:
Including 2.5”SATA, 2.5”PATA, SATA DOM, PATA DOM, mSATA, CFast Card, CF Card, eMMC, eMCP, etc. Applicable to harsh operating temperature environments of industrial grade.
Reliability Testing:
-High and Low Temperature Storage
-High and Low Temperature Operation
-High and Low Temperature Cycling
-ESD Testing
-Vibration and Shock Testing
-Room Temperature Aging Testing
-Power Failure Testing
Wafer Packaging Service:
-First 12" Wafer Packaging Factory in South China
-Include IC Design, Packaging, Testing, Assembling
-Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.
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