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Home > Computer Products > CPU > Intel Core 2 Duo Mobile Processor T8300 SLAPR EC80577GG0563M 6M Cache 2.4 GHz BGA CPU Wholesale Retial

Intel Core 2 Duo Mobile Processor T8300 SLAPR EC80577GG0563M 6M Cache 2.4 GHz BGA CPU Wholesale Retial

Name: Intel Core 2 Duo Mobile Processor T8300 SLAPR EC80577GG0563M 6M Cache 2.4 GHz BGA CPU Wholesale Retial
Brand: Intel
SKU: 122881671
Availability: InStock

Intel Core 2 Duo Mobile Processor T8300 SLAPR EC80577GG0563M 6M Cache 2.4 GHz BGA CPU Wholesale Retial thumbnail-1

Intel Core 2 Duo Mobile Processor T8300 SLAPR EC80577GG0563M 6M Cache 2.4 GHz BGA CPU Wholesale Retial photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

Get Latest Price

Products Status:

Stock

Application:

Laptop

Processor Brand:

Intel

Contact Supplier Request Quote Chat Now

Shenzhen Wit Information Co., Ltd.

Payment & Shipping

Payment Methods:

Port of Shipment:

Shenzhen / Hongkong

Delivery Detail:

Delivery time depends on order quantity.

Product Details
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Products Status Stock

Application Laptop

Processor Brand Intel

Type Dual-Core

Processor Type Other, Intel Core 2

L2 Cache Other, Shared 3 MB

Socket Type Other, BGA479

Main Frequency 2.4 GHz

Brand Name Intel

Model Number Intel Core 2 Duo T8300

Place of Origin United States

Specifications

1.Core 2 Duo T8300 SLAPR EC80577GG0563M
2.Competitve price
3.Safty transport
4.Good after service, come with 1 year warrant

Dear sir, please just contact us for the lastest pricing, if we are offline, please send us e-mail for the details, we will reply you as soon as possible.

Working time:
Online service will ba available
GTM+8 9:30AM - 6:30PM

Specifications of Intel Core 2 Duo T8300 SLAPR EC80577GG0563M

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	T8300
# of Cores	2
Clock Speed	2.4 GHz
L2 Cache	3 MB
Bus/Core Ratio	12
FSB Speed	800 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Lithography	45 nm
Max TDP	35 W
Recommended Customer Price	N/A

Package Specifications
TJUNCTION	105°C
Package Size	35mm x 35mm
Processing Die Size	107 mm2
# of Processing Die Transistors	410 million
Sockets Supported	BGA479, PGA478, PPGA478
Low Halogen Options Available	See MDDS

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Execute Disable Bit	Yes