3M 7953MP Membrane Spacer-TDS Die Cut Shapes

Specifications

Long term environmentally stable bond that resists UV light, chemicals, and temperatures to 300F.

Physical Properties(Not for specification purposes)
 

Features:
•Long term environmentally stable bond that resists UV light, chemicals, and temperatures to 300°F.
•Die cuttable, moisture stable liner with easy removal for improved processing of parts.
•High cohesive strength to withstand repeated stresses from switch activation.

 

Applications
•Attach graphic overlay to Membrane Switch circuit.
•Separate circuits within a Membrane Switch.
•Attach Membrane Switch to backer panel.

 

Processing
• Die Cutting:
Use sharp tooling, properly designed for the cutting of pressure sensitive adhesives and the laminated material. It is helpful to lubricate tooling with a low residue "vanishing" type of oil for improved handling.
• Roll Laminating:
Use rubber over steel roll set up with firm application pressure. Make adhesive tosubstrate contact at nip area only to exclude air entrapment.

 

Special Considerations
For maximum bond strength, surface should be thoroughly cleaned and dried. A typical cleaning solvent is heptane or isopropyl alcohol.

 

CAUTION: Follow manufacturer's instructions when using solvents.

Bond strength may be improved with firm application pressure and moderate heat, which will help adhesive flow out and develop better contact with bonding surface. Ideal application temperature range is 70°F to 100°F (21°C to 38°C). Initial application to surfaces below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature is generally satisfactory.

Samples would be sent to you if you really need.