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1900 Series Silicone Thermal Bonding GlueUS$ 28 - 38MOQ: 500 Grams
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Specifications
1900 COB Thermal Bonding Glue1.hot glue,high gel-point
2.matt,good stability
3.strong adhesive strength
Thermal Bonding Glue for COB
King Bali 1900 Bonding Glue is fixed for bonding electronic components and packing, for metal, ceramics, glass, fiber products and rigid plastic encapsulation between bongding, with excellent adhesion strength of this series can be modulated as required curing time.
To avoid affecting the heat -conducting and adhesiveness, please make sure that the surface of the component is clean enough and theres no such as dirt, oil or salt on it. . Well mix A in the original container before using for precipitation might appear after long time storage.
Weigh A and B exactly according to the specified ratio and then mix them well color difference exist for A and B, please mix them till color difference disappears) . Please use the mixed products in 1-2 hour(s). Over-time using leads viscosity increase. A proper amount is suggested to avoid wasting. . Thicker than 0.15mm application of the products causes lower speed of curing, lower heat conductibility and waste. . The speed of curing might be affected by seasons and temperature. Low speed in winter is possible. Heating to accelerate uring is recommended.
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- Your inquiry related to our product & price will be replied within 24hours.
- Well-trained & experienced staff are to answer all your inquiries in English of course.
- OEM & ODM projects are highly welcomed. We have strong R&D team here to help.
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- Good after-sale service offered, please get back if you got question.
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