CPU Atom N270 SLB73 Intel Processor 512K Cache, 1.60 GHz, 533 MHz cpu processor Quality Choice Most Popular

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cpu processor SLB73
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CPU  Atom N270 SLB73 AU80586GE025D Intel Processor N270(512K Cache, 1.60 GHz, 533 MHz FSB)    cpu processor SLB73

 

 

 

 

 

 

Product Overview

The Intel Atom processor N270,Δ implemented in 45nm technology, is power-optimized and delivers robust performance-per-watt for cost-effective embedded solutions. Featuring extended lifecycle support, this processor offers an excellent solution for embedded market segments such as digital signage, interactive clients (kiosks, point-of-sale terminals), thin clients, digital security, residential gateways, print imaging, and commercial and industrial control. The processor remains software compatible with previous 32-bit Intel architecture

and complementary silicon. This single-core processor is validated with the Mobile Intel

945GSE Express chipset, consisting of the Intel 82945GSE Graphics Memory Controller Hub and Intel I/O Controller Hub 7-M. The chipset features power-efficient graphics with an

integrated 32-bit 3D graphics engine based on Intel Graphics Media Accelerator 950 architecture with SDVO, LVDS, CRT, and TV-Out display ports. It provides rich I/O capabilities and flexibility via high-bandwidth interfaces such as PCI Express,* PCI, Serial ATA, and Hi-Speed USB 2.0 connectivity. It also includes a single channel for 400/533 MHz DDR2 system memory (SODIMM or memory down), and Intel High Definition Audio1 interface.

Product Highlights

• Intel Atom processor N270 at 1.6 GHz core speed with 533 MHz AGTL+ front-side bus (FSB) and 2.5 watts thermal design power2 (TDP)

• Intel’s hafnium-based 45nm Hi-k metal gate silicon process technology reduces power consumption, increases switching speed, and significantly increases transistor density over

previous 65nm technology

• Hyper-Threading Technology3 (two threads) provides high performance-per-watt efficiency in an in-order pipeline and increased system responsiveness in multi-tasking

environments. One execution core is seen as two logical processors, and parallel threads are executed on a single core with shared resources

• Enhanced Intel SpeedStep Technology reduces average system power consumption

• Enhanced low-power sleep states (C1E, C2E, C4E) are optimized for power by forcibly reducing the performance state of the processor when it enters a package low-power state

• Dynamic L2 cache sizing reduces leakage due to transistor sleep mode

• Intel Streaming SIMD Extensions (SSE) 2 and Intel SSE3 enable software to accelerate data processing in specific areas, such as complex arithmetic and video decoding

• FSB lane reversal enables flexible routing

• Execute Disable Bit4 prevents certain classes of malicious “buffer overflow” attacks

 

 

 

 

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q2'08
Processor Number	N270
# of Cores	1
# of Threads	2
Clock Speed	1.6 GHz
L2 Cache	512 KB
Bus/Core Ratio	12
FSB Speed	533 MHz
FSB Parity	No
Instruction Set	32-bit
Instruction Set Extensions	SSE2, SSE3, SSSE4
Embedded Options Available	Yes
Supplemental SKU	No
Lithography	45 nm
Max TDP	2.5 W
VID Voltage Range	0.9V-1.1625V
1ku Bulk Budgetary Price	$44.00
Package Specifications
TJUNCTION	90°C
Package Size	22mm x 22mm
Processing Die Size	26 mm2
# of Processing Die Transistors	47 million
Sockets Supported	PBGA437
Halogen Free Options Available	Yes

 

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	Yes
Intel® Virtualization Technology (VT-x)	No
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Intel® Trusted Execution Technology	No
Intel® 64	No
Idle States	No
Enhanced Intel® Speedstep Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

 

 

Contact us if you are interested in buying laptop parts such as:

Motherboard chip: North and South chipset, Graphic chip, Sound Chip, Ethernet Chip, I/O chip, Power Chip.

Laptop parts: ODD, Keyboard, LCD panel, Power Adapter

Computer repair tool: Test card, Solder balls, Solder paste, Flux, BGA Reballing Station, BGA stencil

 

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