AU80586GE025D SLB73 INTEL CPU Atom N270
Specifications
Intel Atom N270 / 1.6GHz/ 512K L2/ 533 FSB/ 437-ball FC-BGA8sSpec Code : SLB73 / OEM Order Code : AU80586GE025D
CPU Atom N270 SLB73 AU80586GE025D Intel Processor N270(512K Cache, 1.60 GHz, 533 MHz FSB)
Product Overview
The Intel Atom processor N270,Δ implemented in 45nm technology, is power-optimized and delivers robust performance-per-watt for cost-effective embedded solutions. Featuring extended lifecycle support, this processor offers an excellent solution for embedded market segments such as digital signage, interactive clients (kiosks, point-of-sale terminals), thin clients, digital security, residential gateways, print imaging, and commercial and industrial control. The processor remains software compatible with previous 32-bit Intel architecture
and complementary silicon. This single-core processor is validated with the Mobile Intel
945GSE Express chipset, consisting of the Intel 82945GSE Graphics Memory Controller Hub and Intel I/O Controller Hub 7-M. The chipset features power-efficient graphics with an
integrated 32-bit 3D graphics engine based on Intel Graphics Media Accelerator 950 architecture with SDVO, LVDS, CRT, and TV-Out display ports. It provides rich I/O capabilities and flexibility via high-bandwidth interfaces such as PCI Express,* PCI, Serial ATA, and Hi-Speed USB 2.0 connectivity. It also includes a single channel for 400/533 MHz DDR2 system memory (SODIMM or memory down), and Intel High Definition Audio1 interface.
Product Highlights
• Intel Atom processor N270 at 1.6 GHz core speed with 533 MHz AGTL+ front-side bus (FSB) and 2.5 watts thermal design power2 (TDP)
• Intel’s hafnium-based 45nm Hi-k metal gate silicon process technology reduces power consumption, increases switching speed, and significantly increases transistor density over
previous 65nm technology
• Hyper-Threading Technology3 (two threads) provides high performance-per-watt efficiency in an in-order pipeline and increased system responsiveness in multi-tasking
environments. One execution core is seen as two logical processors, and parallel threads are executed on a single core with shared resources
• Enhanced Intel SpeedStep Technology reduces average system power consumption
• Enhanced low-power sleep states (C1E, C2E, C4E) are optimized for power by forcibly reducing the performance state of the processor when it enters a package low-power state
• Dynamic L2 cache sizing reduces leakage due to transistor sleep mode
• Intel Streaming SIMD Extensions (SSE) 2 and Intel SSE3 enable software to accelerate data processing in specific areas, such as complex arithmetic and video decoding
• FSB lane reversal enables flexible routing
• Execute Disable Bit4 prevents certain classes of malicious “buffer overflow” attacks
SPECIFICATIONS
Essentials | |
Status |
Launched |
Launch Date |
Q2'08 |
Processor Number |
N270 |
# of Cores |
1 |
# of Threads |
2 |
Clock Speed |
1.6 GHz |
L2 Cache |
512 KB |
Bus/Core Ratio |
12 |
FSB Speed |
533 MHz |
FSB Parity |
No |
Instruction Set |
32-bit |
Instruction Set Extensions |
SSE2, SSE3, SSSE4 |
Embedded Options Available |
Yes |
Supplemental SKU |
No |
Lithography |
45 nm |
Max TDP |
2.5 W |
VID Voltage Range |
0.9V-1.1625V |
1ku Bulk Budgetary Price |
$44.00 |
Package Specifications | |
TJUNCTION |
90°C |
Package Size |
22mm x 22mm |
Processing Die Size |
26 mm2 |
# of Processing Die Transistors |
47 million |
Sockets Supported |
PBGA437 |
Halogen Free Options Available |
Yes |
Advanced Technologies | |
Intel® Turbo Boost Technology |
No |
Intel® Hyper-Threading Technology |
Yes |
Intel® Virtualization Technology (VT-x) |
No |
Intel® Virtualization Technology for Directed I/O (VT-d) |
Yes |
Intel® Trusted Execution Technology |
No |
Intel® 64 |
No |
Idle States |
No |
Enhanced Intel® Speedstep Technology |
Yes |
Intel® Demand Based Switching |
No |
Thermal Monitoring Technologies |
Yes |
Execute Disable Bit |
Yes |
Contact us if you are interested in buying laptop parts such as:
Motherboard chip: North and South chipset, Graphic chip, Sound Chip, Ethernet Chip, I/O chip, Power Chip.
Laptop parts: ODD, Keyboard, LCD panel, Power Adapter
Computer repair tool: Test card, Solder balls, Solder paste, Flux, BGA Reballing Station, BGA stencil
Connector: DC jack, RJ45, RJ11, VGA connector, Audio and Video connector, Memory socket, CPU sock
Send Inquiry to This Supplier
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