Fr4 pcb pcba manufacture & electronics printed circuit boards

Packaging Details:

The electronic PCBA PCB assembly, PCB PCBA,PCB design in Sograce is: 
inner packing: Vacuum packing / Plastic bag 
Outer packing: Standard carton packing

Delivery Detail:

3-5 working days for sample,7-10 working days for mass order

Product Description

♦ Layer: 6 layer                                           

♦ Thickness: 1.6mm

♦ Material: FR4                                            

♦ Copper thickness: 35um

♦ Mini Hole: 0.2mm                                      

♦ Mini Width/space: 0.1mm/0.1mm                    

♦Surface Treatment: Lead-Free HASL                                             

♦ Solder mask: red/ Green                            

Files

Gerber, Protel, Powerpcb, Autocad, Cam350, etc

Material

FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)

Layer No.

1 - 30 Layers

Board thickness

0.0075"(0.2mm)-0.125"(3.2mm) 

Board Thickness Tolerance

±10%

Copper thickness

0.5OZ - 4OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:01

Hole Registration

0.004"(0.1mm)

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-3u''

OSP

0.2-0.5um

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Surface finish

HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,

Certificate 

ROHS  ISO9001:2000  TS16949  SGS  UL

Special requirements

Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger