Thermal Pad Thermal Heating

Specifications

Thermal Pad Thermal Heating
1.Thermal Conductivity:1.0w/m.k
2.Fiberglass reinforced for puncture,shear and tear resistance

Thermal Pad Thermal Heating

 

Features & Benefits:

-Thermal conductivity:1.0w/m.k                                

-One side slightly tacky, the other side moderate tacky

-Ultra softness offer high conformability at low stress application.

-Reinforced fiberglass for puncture, shear or tear resistance.

 

Typical Application Includes:

-Flat panel display    -Handheld devices

-Memory modules    -PDP display

 

Configurations:

-Sheet form, die-cut parts

-Tape application available

 

Size available:

200x400mm

 

Thickness available:

0.5-15.0mm, increment by 0.5mm

 

Properties:

Typical Properties of Gap Pad LD8100+F100
Property	Unit	Metric Value	Test Method
Color	***	Pink&White	Visual
Thickness	mm	0.5~15.0	ASTM  D374
Density	g/cc	2	ASTM  D792
Hardness	Shore C	15±5	ASTM  D2240
Tensile Strength	KN/m	2.5	ASTM  D412
Continuous Use Temp.	°C	-40-150°C	EN 344
Electrical
Breakdown Voltage	Kv/mm	≥6.3	ASTM  D149
Volume Resistivity	Ω.cm	6.2×1015	ASTM  D257
Flame rating	V-0	V-0	UL  94
Thermal
Thermal Conductivity	W/m.k	1.0	ASTM D5470

For more details and application direction,welcome to contact our sales!