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Heat Sink Attachment Thermal conductive Tape
Features & Benefits:
² High bond strength to a variety of low energy surfaces
² Easy Application
² Eliminates need for screws,clips,etc.
² Available with easy release tabs
Configurations:
² Roll form,sheet form
² Die-cut parts with tabs
Available sizes:
² Thickness: 0.1,0.15,0.2,0.25,0.3,0.4,0.5mm
² Width:1030mm
² Length:50m
² Custom size:please contact local sales of Leader for information and availability of die-cut parts.
Typical Application Includes:
² LED Lightings
² Between heat sinks/spreaders and chips
² DDR RAM assembly
Properties | 8N12-T10 | 8N12-T15 | 8N12-T20 | ||
Carrier | NONE | NONE | NONE | ||
Thickness | 0.10mm | 0.15mm | 0.20mm | ||
Adhesion | |||||
Peel Strength(PSTC-101)(N/25mm) | >13.72 | >13.72 | >15.68 | ||
Temp Resistance(S)°C (°F) | 180(356) | 180(356) | 180(356) | ||
Temp Resistance(L)°C(°F) | 120(248) | 120(248) | 120(248) | ||
Continues Use. Temp.(°C) | -20 to 120 | -20 to 120 | -20 to 120 | ||
Retention(1Kg/Inch/25°C) | >48 | >48 | >48 | ||
Adhesion(Kg/Inch) | 1.4 | 1.4 | 1.4 | ||
Initial Adhesion(J.DOW) | 12 | 14 | 16 | ||
Electrical | |||||
Breakdown Voltage(KV) | 2.22 | 2.55 | 4.29 | ||
Thermal | |||||
Thermal conductivity (ASTM D5470) | 1.2w/m.k | 1.2w/m.k | 1.2w/m.k | ||
Thermal Resistance(AMD240)@40PSI | 0.558C*in2/w | 1.07C*in2/w | 1.173C*in2/w | ||
Remark:
a. Data for design engineer spec. reference only. Engineers are reminded to test the material in application.
b. Shelf life: 15 months from date of manufacture when stored at storage temperature 23±5 ° C ,relative humidity is 60% in the products original packaging.
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