FPC Polyimide Film
Polyimide tape
Polyimide (PI) adhesive tape,Insulation material for tansformer.
Application: Polyimide (PI) adhesive tape, Insulation material for tansformer. This item is used for SMD packing and transformer manufacturing.
Specification: 1. Polyimide base film coating with high temperature Silicone adhesive;
2. High temperature and corrosion resistance;
3. Strong adhesion;
4. Soft and proper and no residue after peeling off.
5. For electronic manufacturing industry.
We are one of the most professional Chinese tapes' manufacturers and leaders.
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