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Specifications
1. custom design flexible printed circuit2. flexible printed circuit 8 layers
3. double sided flexible circuit
flexible printed circuit specifications:
Layers: 1-2 layers (flexible)
Thick bottom material: 25, 50, 75, 100um, 1 / 2, 1, 2, 3mil
Thick copper conductor: 18, 35, 70um, 1 / 2, 1, 2oz
Material: polyester and polyimide
Copper: RA, ED
Minimum aperture: 0.2mm
Minimum spacing: 0.1mm
The smallest ring porous: 0.1mm
The largest panel size: 400 x 400mm
Plating: welding, nickel, gold
Volume Resistance aluminum: 1 x 1015 (IPC-TM-650 2.5.6.17)
Dissipation factor (1MHz): 0.04 (MIL-P55617)
Solder heat resistance: 300 degrees C/10 seconds
Strength: 5kV (IPC-TM-650 2.5.6.1)
Insulation Resistance: 1,000 mW (IPC-TM-650: 2, 6, 3, 2)
Primary Competitive Advantages:
1. Prompt Delivery
2. Quality Control (IQC, On line Inspection, OQC, ISO9001 and 5S)
3. Reputation
4. Service
5. Small Orders Accepted
6. Superior R&D Background (continuously new product development and current product improvement)
7. Customize Design / Production (OEM/ODM business and flexible designs for customers' special requirements)
Shenzhen Lunfeng Technology Co., Ltd. is a manufacturer engaged in the production, sale, and service of Flexible Printed Circuit.
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