Home > Electrical & Electronics > Circuit Board > Multilayer PCB > Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan .

Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan .

Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan . photo-1
Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan . photo-2
Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan . photo-3
Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan . photo-4
Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan . photo-5
Fr4 Copper Clad Laminated Board ,Insulation Panel Insulation Board, Heat Insulation Material, Insulation From Taiwan . photo-6
US$ 1.35 - 3.3 MOQ: 1 Metric Ton
Key Specifications
Get Latest Price
Place of Origin:
Taiwan, China
Brand Name:
g10 fr4 sheet
Model Number:
Copper Clad Laminate
Payment & Shipping
Payment Methods:
Port of Shipment:
Keelung harbor
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Taiwan, China
Brand Name g10 fr4 sheet
Model Number Copper Clad Laminate
Base Material epoxy fiberglass
Copper Thickness single sided, double sided
Board Thickness 0.8mm ~ 2.0cm
Min. Hole Size g10 fr4 sheet
Min. Line Width 5 ~ 20cm up
Min. Line Spacing fr4 copper clad laminate
Surface Finishing g10 fr4 sheet
  CCL  copper clad laminated sheet

 

 Product Description

         CCL (CCL) for the printed circuit board (PCB) of the main material, an average of 20 ~ 50% PCB cost of raw materials, consists of reinforcing the strength of fiberglass cloth and epoxy resin insulation plus copper from copper substrates.  fr4 copper clad laminate
      Technical development CCL functional requirements from the electronics market toward compact size, high reliability, multi Outsider, green technology and high throughput rate trend. Containing a high density interconnect (HDI), high layer count boards (HLC), IC carrier board and high-reliability applications such as automotive panels on computers, mobile phones, and other consumer electronics products, high functional green base with a strong growth potential, will be the focus of future development PCB products.

 fr4 copper clad laminated board ,Insulation panel Insulation board, heat Insulation material, Insulation from Taiwan .

Specifications

FR4 Copper Clad Laminate Sheet
1.Spe : FR-1 ,FR-4 ,CEM-1 ,CEM-3

2.Thickness:0.6,0.8,1.0,1.2,1.6,2.0mm.
3.Copper thickness : single/double sides

   (H/H, H/0, 0/0, 1/1, 1/H)

4.With : more than 7~9.9cm , 10~14.9cm , 15cm up ,with different prices.

5.Length : 30~120cm

 

Company Information

 We JIN CHEN JIA TECHNOLOGY CO LTD , not only professional for producing Copper Clad Laminate, unclad laminate ,prepreg since 2006. We also have very good business relationship with Taiwan's big electronics company ,such as Taiwan Nanya ,Taiwan glass, so we can get very competitive price for the products, if you have any interest , please just feel free to contact us in work's time.

Mon ~ Fri    8:30am~17:30pm

 

fr4 copper clad laminated board ,Insulation panel Insulation board, heat Insulation material, Insulation from Taiwan .

FAQ

 Q1. Are you a factory or trading company ??

 A : We are a manufacturer with a export license.

 

 Q2 : Can I have free sample ??

 A: Yes , we can provide you free sample for checking after you accept our price and all the information confirmed by your side.

 

Q3. What is the manufacturing time /lead time ??

 A: For mass production it needs around 5-15 days , it depends on qty.

 

Q4. The products can be customized from your size ??

 A: Yes , we can produce the goods according to your requesets.  fr4 copper clad laminate

fr4 copper clad laminated board ,Insulation panel Insulation board, heat Insulation material, Insulation from Taiwan .fr4 copper clad laminated board ,Insulation panel Insulation board, heat Insulation material, Insulation from Taiwan .fr4 copper clad laminated board ,Insulation panel Insulation board, heat Insulation material, Insulation from Taiwan .

Send Inquiry to This Supplier

Message
0/5000

Want the best price? Post an RFQ now!
Business Type
Trading Company, Distributor/Wholesaler
Year Established
2006
Factory Size
Below 1,000 square meters
Total Employees
5 - 10 People

Recommended Categories

Explore top categories and find suppliers for your specific needs