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SMNCM-3 Contactless Smart Card Chip Bonding Machine
US$ 16,667 - 30,000
MOQ: 1 Set
Key Specifications
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Place of Origin:
Zhejiang, China
Brand Name:
SmartManufacture
Model Number:
SMNCM-3
Payment & Shipping
Payment Methods:
Port of Shipment:
Shanghai
Delivery Detail:
Delivery time depends on order quantity.
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Place of Origin
Zhejiang, China
Brand Name
SmartManufacture
Model Number
SMNCM-3
Specifications
SMNCM-3 Contactless Smart Card Module Bonding Machine is full automatic load the modules one by one and bond the modules in holeSMNCM-3 Contactless Smart Card Module Bonding Machine is full automatic load the modules one by one and bond the modules in holes on sheet.
1. The system can follow and adjust the ultrasonic parameter automatically during running.
2. There are several programs for different sizes of sheets.
3. Servo motor controls the bonding location
4. Use advanced ultrasonic technology with high electrical current instant bonding.
5. It is easy to load plastic sheet and easy to adjust with alarm system.
| Embedding Material | ABS, PVC, PET, PETG, Teslin or other mixed plastic materials |
| Embedding Layout | any layout like 2*5, 3*7, 3*8, 3*9, 3*10, 4*8, 4*9, 4*10, 5*5 |
| Embedding Head | 2 heads |
| Embedding Size | Double sheets A4, A3, A3+, A2 |
| Control Method | PLC, Touch Sceen, Servo System |
| Air Supply | 0.6MPa 50Liter/minute |
| Servo Precision | X and Y =0.125mm |
| Working Efficiency | 2500-3000pcs per hour |
| Voltage | 380V 50/60Hz |
| Power | 3KW |
| Packing Size | 1850mm*960mm*1750mm |
| Net/Gross Weight | 800KGS/900KGS |
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Business Type
Trading Company
Year Established
2013
Factory Size
Below 1,000 square meters
Total Employees
11 - 50 People
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