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Copper Plating Machine for PCB Plating
Main technical parameter:
Power:380V/50HZ
Tank size:300*600*700mm (customer can order tank size)
Tank material:12mmPP + 15mPP
Heater Material:Titanium,3KW/pc
Rectifier:6V,100A
Filter:5um and 10um
Automatic Control System:
Times control system;
Temperature control system;
Auto Air mixture system;
Network filter system;
Process flow: Load -- Conditioner-- Dragout rinse -- Running rinse -- Microetch -- Dragout Rinse --Running rinse -- Predip--Catalyst-- Dragout Rinse-- Running Rinse--Electroless Copper-- Electroless Copper-- Electroless Copper -- Counterflow rinse -- Counterflow rinse -- Sulphuric Dip -- Acid Copper -- Dragout Rinse -- Counterflow rinse -- Counterflow rinse -- Offload
Features: The copper plating machine can coat more thick copper on the clad plate,so the electrical conductivity will be strong.
Equipment Pictures:
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