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Specifications
1.doorbell pcba2.Efficient Quotation,Strict Production,Reliable Quality
3.Certificates:UL,ISO9001,Rohs
4.Fast delivery
Your Best Choice for Printed Circuit Board Manufacturing & Assembly
OEM/ODM/EMS Services for PCBA:
- PCBA, PCB Board assembly: SMT & PTH & BGA
- PCBA and enclosure design
- Components sourcing and purchasing
- Quick prototyping
- Plastic injection molding
- Metal sheet stamping
- Final assembly
- Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
- Custom clearance for material importing and product exporting
Capability - SMT
Lines 9(5 Yamaha,4KME)
Capacity 52 million placements per month
Max Board Size 457*356mm.(18”X14”)
Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
Speed 0.15 sec/chip,0.7 sec/QFP
Capability - PTH
Lines 2
Max board width 400 mm
Type Dual wave
Pbs status Lead-free line support
Max temp 399 degree C
Spray flux add-on
Pre-heat 3
Technical Data:
Stencil size/range: |
736x736mm |
Minimum IC pitch: |
0.30mm |
Maximum PCB size: |
1200x 500mm |
Minimum PCB thickness: |
0.35mm |
Minimum chip size: |
0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: |
74x74mm |
BGA ball pitch: |
1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: |
0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: |
0.38mm (minimum), 2.54mm (maximum) |
Frequency of stencil cleaning: |
1 time/5 to 10 pieces |
Turn Times: |
Quick turn are our Specialty |
Volume: |
One piece to low valume production quantityes Low cost first article builds Schedule deliveries |
Assembly type: |
Surface mount(SMT) assembly Thru-hole Mixed(surface mount and thu-hole) technology Single or double sided placement Cable assembly |
Components type: |
Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
|
Stencil: |
Laser cut stainless steel |
Parts procurements: |
Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type: |
Leaded Lead-free/ROHS compliant |
Other capabilities: |
Repair/rework services Mechanical assembly Box build/electromechanical assembly Mould and plastic injection. |
AOI Testing
·Checks for solder paste
·Checks for components down to 0201"
·Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
·BGAs
·Micro BGAs
·Chip scale packages
·Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
·Power-up Test
·Advanced Function Test
·Flash Device Programming
·Functional testing
OUR PARTNTERS
Applications:
Defence, broadcasting,medical,telecommunication systems,industrial control, traffic intelligence systems, auto industry, agriculture and so on.
About Fulltronics
Our service: Design/Layout of Printed Circuit Boards, PCB Fabrication, Component Assembly, Wire Harness Assembly, Box Assembly, Parts Procurement, Component Forming and Electrical Testing.
We are certifiedwith: ISO9001 & ts16949, UL Certification and ROSH if required.
Type of facility: Manufacturing
Facility Size: 110,000 sq meter
Total Number f Employees:400-500
Total Production:20,000-30,000 sq m./month
Top three Major Customer: America,Euerope,Africa
Estimated Annual Sales: around 8 million
Work days: Monday - Friday, 9am to 6pm
QUOTE REQUIREMENTS FOR PCB AND PCB ASSEMBLY:
- Gerber File and Bom List;
- Quantity;
- Technical requirements for quoting reference;
- Clear pictures of PCB or PCB Assembly sample if avaliable.
- Inspection method for PCB Assembly.
We purchase material from Original company.
We make products by strict engineer processes .
We send products by vacuum package and carton box .
Send Inquiry to This Supplier
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